Call for Papers Now Open for ITCC 2021

Call for Papers Now Open for ITCC 2021

Submit your abstract for the International Thermal Conductivity Conference (ITCC) 2021 in Boston! NETZSCH is inviting all partners, customers and scientists working in the field of thermal conductivity to send their abstracts dealing with new developments in theory, analysis, simulation and modelling, experimentation, demonstration, and case studies.

NETSCH Instruments NA is hosting the 35th International Thermal Conductivity Conference (ITCC) as well as the 23rd International Thermal Expansion Symposium (ITES) in Boston Massachusetts, USA. The event will take place from September 26 to September 29, 2021.

Submit your Abstract Today!

NETZSCH is inviting all partners, customers and scientists working in the field of thermal conductivity to send their abstracts dealing with new developments in theory, analysis, simulation and modelling, experimentation, demonstration, and case studies. From August 1, 2020, you can submit the abstracts for an oral or poster presentation here! Fill out the form and copy your abstract into the designated field.

A Conference Embracing Many Industries, Materials and Applications

The conference’s topics of interest include, but are not limited to, the following:
  • Advanced ceramics
  • Characterization of thermal properties of anisotropic materials
  • Biomaterials
  • Foods
  • Iron and alloys
  • Nano materials
  • Polymers
  • Thermoelectric materials
We are excited to host the conference and give you the opportunity to present your work in front of peers from industry, academia and government labs. The time to submit your paper is open now until June 15, 2021. You can find more information concerning the important dates and the paper submission process at the conference website! The 35th International Thermal Conductivity Conference is waiting for your abstracts!
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