Thermal Interface Materials (TIM): Thermal Conductivity Testing

TIM Application

Characterization of the thermal performance of thermal interface materials (TIM) used in electronics packaging can be critical to maintaining reliable performance, especially with the rapidly increasing heat dissipation requirements of each new generation of electronic components.
To make routine measurements on TIM’s faster – without the impact of contact resistance, you can rely on Light- or Laser-Flash Methods (ASTM E1461)

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Flexible layer structured Bi2Te3 thermoelectric on a carbon nanotube scaffold

NETZSCH in Nature

Thermoelectric materials with a high efficiency that are used, for example, to generate electricity from heat, are naturally brittle and fragile. It would be much more user-friendly to use flexible materials. There are already thin plastic films, so-called PEDOT´s, which are flexible and can be applied over large areas at low cost. However, these have … Read moreFlexible layer structured Bi2Te3 thermoelectric on a carbon nanotube scaffold