ITCC 2021: Registration Open Now & First Speakers Announced

ITCC 2021: Registration Open Now & First Speakers Announced

NETZSCH Instruments North America is hosting the combined 35th International Thermal Conductivity Conference (ITCC) and 23rd International Thermal Expansion Symposium (ITES) in Boston Massachusetts, USA. Registration to the event is currently open and the first plenary speakers have been annouced!

NETZSCH Instruments North America is hosting the combined 35th International Thermal Conductivity Conference (ITCC) and 23rd International Thermal Expansion Symposium (ITES) in Boston Massachusetts, USA. The event will take place from September 26 to September 29, 2021.

Get your discounted ticket now!

Registration to the event is currently open. Early bird discount is available until July 1, 2021. We also offer special conditions for retired professionals and students.

What are you in for at the conference?

We expect outstanding specialists in the field of thermophysical properties to report on their latest research projects. We are particularly honored to have renowned and high-profile plenary speakers for the event.

Dr. Tetsuya Baba (National Institute for Materials Research, Japan) will speak about the evolution of the laser flash method for bulk materials to the ultra fast laser flash method for thin films by pico/nano second repetitive pulsed light heating.

Prof. Weidenkaff (Fraunhofer Institut, Germany) will present her work on sustainable high-performance thermoelectric materials by thermal engineering.

Dr. Sanghyun Lee (KRISS (Korea Research Institute of Standards and Science, Korea) will speak about his construction and testing of a guarded hot plate apparatus for thermal conductivity measurements at high temperatures.

Dr. Hans-Peter Ebert (ZAE Bayern, German) will give insights into the thermal characterization of high-performance insulation – not always an easy task.

Dr. Erhard Kaschnitz (Österreichisches Gießerei-Institut (ÖGI)) will highlight the importance of high-temperature thermophysical properties for the numerical simulation of construction materials exposed to fire load.

Prof. Dr. Anne Hofmeister (Washington University, MO, USA) will share experimental and theoretical evidence for heat being conducted in solids by diffusing infrared light.

Prof. Emeritus Dr. Yuji Nagasaka (Department of System Design Engineering, Faculty of Science and Technology, Keio University, Japan) shares his work on grating excitation techniques: Creation of nano/microscale transport properties sensing engineering and its progress

Dr. Takashi Yagi (National Metrology Institute of Japan (NMIJ), National Institute of Advanced Industrial Science and Technology (AIST)), will present ultra-fast heat diffusion measurement – application to thin layers, interfaces and extreme conditions (preliminary title).

Become part of the conference and submit your abstract today!

We encourage you to submit an abstract and present at this conference. This premier conference series has a long history: it has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development. This conference will feature thermal conductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.

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