Due to the Covid pandemic, the ITCC board has decided to postpone the event until 2022!
NETZSCH Instruments North America is hosting the combined 35th International Thermal Conductivity Conference (ITCC) and 23rd International Thermal Expansion Symposium (ITES) in Boston Massachusetts, USA.
The event will take place from Sunday, March 20 to Wednesday, March 23, 2022.
Important dates: Mark your calendar now
- Early-bird Registration Deadline: November 30th, 2021
- Regular Registration Deadline: February 20th, 2022
- Final Abstract Submission: November 30th, 2021
- Notification of Abstract Acceptance: December 15th, 2021
What are you in for at the conference?
There will be outstanding specialists in the field of thermophysical properties reporting on their latest research projects. We are particularly honored to have renowned and high-profile plenary speakers for the event.
Become part of the conference
We encourage you to submit an abstract and present at this conference. This premier conference series has a long history: it has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development.
This conference will feature thermophysical properties research for materials (including techniques and applications) with a focus on thermal conductivity and thermal expansion.