NETZSCH is Hosting the 35th International Thermal Conductivity Conference (ITCC)

We are excited to share the news that NETZSCH Instruments NA is hosting the 35^th International Thermal Conductivity Conference (ITCC) and the 23^rd International Thermal Expansion Symposium (ITES)! The events will take place from September 26 to September 29, 2021 in Boston, Massachusetts, USA. This premier conference series has a long history, and has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development. This conference will feature thermal conductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings are published in hard cover format following the conference and a rigorous peer review.

Call for papers open from August 1

Summit your abstract from August 1, 2020 to receive the chance to present it at the conference in front of peers from industry, academia and government labs.

Registration open from September 1

From September 1, 2020 Early Bird Registration will be open.

Further important dates:

June 15, 2021 – Final Abstract Submission Deadline June 30, 2021 – Notification of Abstract Acceptance July 1, 2021 – Early-bird Registration Deadline August, 20, 2021 – Regular Registration Deadline September 26, 2021 – Start of the conference

Stay up to date!

Do not miss the opportunity to grow your network with engineers, researchers and project managers in the field of thermal conductivity. Visit www.thermalconductivity.org for more information! Follow us on LinkedIn and subscribe to our newsletter to stay up to date on important dates and updates on the upcoming premier conference on thermal conductivity hosted by NETZSCH.