Analysis of Rheological Data Including Prediction of the Complex Viscosity
Epoxy resins are commonly used for coating, lamination and electronic materials. Their field of application extends to adhesive applications, especially when durability and strength are needed. Many epoxy adhesives consist of two components, the epoxy resin and a hardener. As soon as the two compounds are mixed, curing begins: bonds are created between the epoxy resin and the hardener, forming a structural network. In practice, the start of the reaction and the duration of reaction are of interest. In this article by Claire Strasser, Dr. Elena Moukhina and Torsten Remmler the changes in rheological properties of a two-part epoxy glue during curing are investigated by means of the NETZSCH Kinexus rotational rheometer. Read here what we found out: Download Application Note
Measuring Results with the Kinetics Neo Software at Highest Level
The rheological curing profile of a 2-part epoxy resin was recorded by a Kinexus rotational rheometer. Rheometer measurements were carried out at different heating rates and then imported in Kinetics Neo to determine the kinetics of the reaction. A big advantage of the Kinetics Neo software is the possibility to provide results for the long-time behavior based on 3 relatively short heating measurements. However, this powerful software goes further, as it can also predict the sample’s behavior at any operating time/temperature condition. Learn more about our Kinetics Neo software: https://kinetics.netzsch.com/
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Watch our new video by Dr. Elena Moukhina “The New Kinetics Neo Feature: Analysis of Rheological Data Including Prediction of Viscosity”:
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In one of our next blog posts, we will then explain how you can also use the Kinetics Neo software to predict the material behavior under fire conditions.