We are excited to share the news that NETZSCH Instruments NA is hosting the 35th International Thermal Conductivity Conference (ITCC) and the 23rd International Thermal Expansion Symposium (ITES) in September 2021. Learn more!
For the 20th time, the “Joint Research in Adhesives Bonding Technology” colloquium took place in Würzburg (Germany). 230 participants discussed their research results, new developments and challenges together. From the many interesting and informative presentations on the first day, four trends pointing the way to the future will be revealed.