Kinetic analysis of shear viscosity to predict the curing behavior of an epoxy adhesive
The NETZSCH Kinetics Neo software can not only be used for the analysis of temperature-dependent processes using thermal analysis data. It is now also possible to simulate rheological properties during curing based on the measured data from our Kinexus rotational rheometer. Learn more about the kinetic analysis of the curing behavior of a 2-Part epoxy adhesive.