Thermal Interface Materials (TIM): Thermal Conductivity Testing

TIM Application

Characterization of the thermal performance of thermal interface materials (TIM) used in electronics packaging can be critical to maintaining reliable performance, especially with the rapidly increasing heat dissipation requirements of each new generation of electronic components.
To make routine measurements on TIM’s faster – without the impact of contact resistance, you can rely on Light- or Laser-Flash Methods (ASTM E1461)

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Sintering Process up to 60% Faster

Speed up your sintering process up to 60%

This article and video shows, how you can design your sintering process to the best with KINETICS NEO and the data from Thermal Analysis. Simulate before firing and speed up your sintering process up to 60%

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