Filler type, filler content and filler orientation: everything plays a role when it comes to tailoring thermal conductivity of polymers for specific applications, such as in the well-known field of Metal Replacement. Read how our customer DOMO Engineering Materials uses our instrument to research conductive raw materials.
Additive Manufacturing (AM) encompasses a variety of technologies suitable for producing components from liquid, solid or powder feedstocks. Selective Laser Melting (SLM), a powder-bed fusion process, has become a commonly used AM process for rapid prototyping and component manufacturing using metals, alloys and, to a lesser extent, ceramics. Learn more about SLM, suitable materials and how to optimize input parameters for improved product quality using Thermal Analysis.
We are pleased to announce that, effective October 30, 2020, PicoTherm Corporation joined the NETZSCH Group as a wholly owned subsidiary of NETZSCH Japan, K.K.
Thermal conductivity and diffusivity are the most important thermophysical material parameters for the description of the heat transport properties of a material or component. Since the Laser Flash Analysis is an optical method that needs to eliminate reflection, special attention needs to be put on the sample preparation, for instance with a graphite coating. Learn in the video below why the way of coating a highly conductive sample depends on which material property is to be determined.
Four technology-driven trends disrupt the automotive industry and transform mobility as we know it today. Our future cars will be autonomous, electric, shared and connected. Polymer parts and components will not become redundant. They will rather be used for different applications. Learn which material properties are crucial in tomorrow’s cars.
Characterization of the thermal performance of thermal interface materials (TIM) used in electronics packaging can be critical to maintaining reliable performance, especially with the rapidly increasing heat dissipation requirements of each new generation of electronic components.
To make routine measurements on TIM’s faster – without the impact of contact resistance, you can rely on Light- or Laser-Flash Methods (ASTM E1461)
Heat must be dissipated from electronic devices quickly and efficiently to ensure optimal performance and to prevent premature component failure. Like CPUs and GPUs, LED inverters as well as photovoltaic inverters require excellent thermal management. Thermal interface materials (TIMs) are available as greases, tapes, filled elastomer pads and phase-change materials.
By Robert Campbell
This article and video shows, how you can design your sintering process to the best with KINETICS NEO and the data from Thermal Analysis. Simulate before firing and speed up your sintering process up to 60%