Residual stress can lead to warpage of a 3D-printed part. Both Dynamic Mechanical and Thermomechanical Analysis are capable to estimate warpage. In this video, Dr. Natalie Rudolph explains, how the coefficient of thermal expansion (CTE), measured with Thermomechanical Analysis, can be used to predict and calculate warpage.
In our last episodes, we focused mainly on thermal material behavior measured with Differential Scanning Calorimetry (DSC). Today, Dr. Nathalie Rudolph will talk about how residual stresses can be estimated using Dynamic Mechanical Analysis (DMA).