Quality Control of Electronic Assemblies Using Thermomechanical Analysis

TMA Polymer Edition Electronic Assemblies1

A major source of failure of electronic assemblies is thermal expansion and the problems it causes. To make sure that the circuit base boards conform to a certain quality, IPC standards were put into place that require measurement of the thermal expansion, glass transition and softening point. Learn how you can comply to the standard with the new TMA 402 F3 Hyperion® Polymer Edition.

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