Imagine the typical situation in everyday laboratory work: A new sample has to be analyzed, but what are the suitable measurement conditions such as temperature program, sample mass or the right crucible? And what measurement results can be expected? Perhaps such kind of sample was already measured by you in the past ‒ or maybe by NETZSCH. Wouldn’t it help a lot to simply search in a database for thermal analysis? Identify, which is a part of the Proteus® analysis software, is the solution!
The New TMA 402 F3 Hyperion® Polymer Edition Modern products made of polymers are all around us. Polymers are used for everyday products but also for challenging applications. The tricky bit is to assure compatibility when different polymers are joined together. For blends or compounds, such as composite materials, the prediction of material behavior in … Read moreUnique Tool for the Prediction of Product Performance and Processing Behavior under Thermal Expansion Control
Fiber-reinforced composite materials, which combine the properties of fibers and a polymer matrix, have been around for decades. There are different ways to incorporate the fiber into the thermoplastic matrix ‒ randomly oriented fibers, unidirectional continuous fibers or multi-directional fabric. The orientation of the added fibers plays an important part when it comes to part properties. Learn why anisotropic behavior of the composite is favorable and how to measure it with the TMA 402 F3 Hyperion® Polymer Edition.
Fillers have long played an important role in the polymer manufacturing industry. An important property to measure how the filled material changes in length when being heated or cooled is the coefficient of thermal expansion. Knowledge about this material behavior is required to be able to determine important design values. Learn how the flow field and sample preparation influences the property and see how measurements with the TMA 402 F3 Hyperion® Polymer Edition are carried out.
A major source of failure of electronic assemblies is thermal expansion and the problems it causes. To make sure that the circuit base boards conform to a certain quality, IPC standards were put into place that require measurement of the thermal expansion, glass transition and softening point. Learn how you can comply to the standard with the new TMA 402 F3 Hyperion® Polymer Edition.
In the previous articles, focusing on thermal analysis under humidity, we have seen that thermogravimetric analysis and dynamic mechanical analysis help determine the influence of water on a material or substance. Thermomechanical analysis complements the analysis under humidity.
Thermoplastic parts can fail. This is no secret. However, when it has happened it is crucial to find out the reason for the failure of a part. Here is a short list of thermal analysis techniques and which questions they can answer in your failure analysis.
Four technology-driven trends disrupt the automotive industry and transform mobility as we know it today. Our future cars will be autonomous, electric, shared and connected. Polymer parts and components will not become redundant. They will rather be used for different applications. Learn which material properties are crucial in tomorrow’s cars.
The actors in the automotive supply chain are constantly forced to keep up with changing requirements in their industry. Higher fuel efficiency and technological innovations bring about environmental regulations that need to be considered in the design of automotive parts and components. Here, crucial material properties like thermal and mechanical resistance can be determined with thermal analysis.
Did you know that motor vehicles were involved in 19 % of all product recalls listed by the Rapid Alert database in 2018? In the automotive industry, recent product failures concern the rupture and leakage of fuel tanks due to errors in the production process. It is crucial to find the cause of failure that can result from either design-, material- or production-related causes. Four thermal analysis instruments can answer many questions.