Fillers have long played an important role in the polymer manufacturing industry. An important property to measure how the filled material changes in length when being heated or cooled is the coefficient of thermal expansion. Knowledge about this material behavior is required to be able to determine important design values. Learn how the flow field and sample preparation influences the property and see how measurements with the TMA 402 F3 Hyperion® Polymer Edition are carried out.
A major source of failure of electronic assemblies is thermal expansion and the problems it causes. To make sure that the circuit base boards conform to a certain quality, IPC standards were put into place that require measurement of the thermal expansion, glass transition and softening point. Learn how you can comply to the standard with the new TMA 402 F3 Hyperion® Polymer Edition.