Material Science in Additive Manufacturing: Warpage Prediction of PBF Parts Using CTE

Residual stress can lead to warpage of a 3D-printed part. Both Dynamic Mechanical and Thermomechanical Analysis are capable to estimate warpage. In this video, Dr. Natalie Rudolph explains, how the coefficient of thermal expansion (CTE), measured with Thermomechanical Analysis, can be used to predict and calculate warpage.

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